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- W2155514492 abstract "The inhibition of the imidization of polyamic acid, a precursor of polyimide, in the presence of Cu, was confirmed by the incorporation of Cu2+ ions in polyamic acid films. It was found that the imidization reaction was incomplete below 300°C but decomposition took place when heating above 300°C. Pretreating the Cu surface with a two-component primer solution containing polybenzimidazole and 2-mercaptobenzimidazole can make the imidization proceed without retardation and avoid the decomposition above 300°C. By choosing appropriate surface treatment systems, one can achieve the improvement of adhesion between PI and Cu substrate. Die Inhibition der Imidisierung einer Polyamidsäure (PAA), dem Vorprodukt eines Polyimids, in Gegenwart von Kupfer wurde durch die Zugabe von Cu2+ -Ionen zu PAA-Filmen bestätigt. Die Imidisierung verlief unterhalb 300°C unvollständig, doch bei Temperaturen über 300°C begann die Zersetzung. Die Vorbehandlung einer Kupferoberfläche mit einer Grundierung aus den zwei Komponenten Polybenzimidazol und 2-Mercaptobenzimidazol ermöglicht, die Imidisierung ohne Verzögerung ablaufen zu lassen und die Zersetzung oberhalb 300°C zu verhindern. Durch geeignete Oberflächenbehandlungssysteme kann die Adhäsion zwischen Polyimid und Kupfersubstrat verbessert werden." @default.
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- W2155514492 date "1995-08-01" @default.
- W2155514492 modified "2023-09-30" @default.
- W2155514492 doi "https://doi.org/10.1002/apmc.1995.052300110" @default.
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