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• W2155663755 abstract "The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics." @default.
• W2155663755 created "2016-06-24" @default.
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• W2155663755 date "1991-01-01" @default.
• W2155663755 modified "2023-09-23" @default.
• W2155663755 title "Flip-chip solder bond mounting of laser diodes" @default.
• W2155663755 cites W4252920349 @default.
• W2155663755 doi "https://doi.org/10.1049/el:19910314" @default.
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