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- W2156850315 abstract "Thermal conductivity of copper and tungsten nanowires, copper damascene structures are modeled theoretically on the basis of Boltzmann transport equation. The size-dependent thermal conductivities of the nanowires are obtained by taking into account interface scattering, grain boundary scattering, and interface roughness effect. Expressions for the thermal conductivity of thin films including the above mechanisms are extended to the case of rectangular cross-sectional nanowires. The fractal model is also used to predict the contribution of interface roughness to the thermal conductivity of nanowires. It is shown that the interface roughness is important for the nanowires with lateral dimensions down to the sub-30 nm region. Calculated thermal conductivities are in good agreement with the experimental data for copper and tungsten nanowires. Furthermore, it is found that the titanium nitride barrier layer obviously leads to further thermal conductivity reduction in the copper damascene structures." @default.
- W2156850315 created "2016-06-24" @default.
- W2156850315 creator A5084907779 @default.
- W2156850315 date "2009-05-01" @default.
- W2156850315 modified "2023-10-18" @default.
- W2156850315 title "Thermal conductivity modeling of copper and tungsten damascene structures" @default.
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- W2156850315 doi "https://doi.org/10.1063/1.3120786" @default.
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