Matches in SemOpenAlex for { <https://semopenalex.org/work/W2157097791> ?p ?o ?g. }
Showing items 1 to 94 of
94
with 100 items per page.
- W2157097791 abstract "New package prototyping is often a sequential process where the chip and system parameters are specified first, then the package design is initiated. A reduction in overall cycle time can be affected if the events occur simultaneously. This study proposes a methodology for addressing this issue. The method is outlined in the context of prototyping the 119 plastic ball grid array (PBGA) package thermal performance. The parameters influencing performance are system, device, or package based. Ranges for the yet-to-be-fixed parameters are determined and factorial analyses are used to yield approximate linear models with interactions for package performance. Once the device and system parameters are fixed, the linear equations are solved simultaneously with junction and board temperature constraints to yield a design options map for package layout. The prototyping sequence for the PBGA results in substrate thermal conductivity, mother board thermal conductivity, mother board load, and heat sink attachment as the set of variable parameters-with other parameters being fixed. The design options map gives the minimum substrate thermal conductivity needed to meet the thermal performance specification for a particular set of parameters. The substrate specification is further related to physical attributes required of the package in terms of thermal vias, thermal bumps and metal layers. These results are generically applicable to the PBGA family. A 119 PBGA package enclosing a 2 W chip requires a minimum substrate thermal conductivity of 0.03 W/cm-/spl deg/C to meet the junction temperature constraint for high performance workstation environments. Results of the performance prediction are further verified by a composite finite element simulation and experimental validation with prototypes. The design options map can be recreated without any additional simulation studies in the event any change in the fixed parameters occurs. The methodology described allows anticipation of design options in the dynamic environment of prototyping, and implementation of optimized package designs to meet performance under multiple customer environments." @default.
- W2157097791 created "2016-06-24" @default.
- W2157097791 creator A5036363549 @default.
- W2157097791 creator A5060431810 @default.
- W2157097791 date "2002-11-19" @default.
- W2157097791 modified "2023-09-25" @default.
- W2157097791 title "Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping" @default.
- W2157097791 cites W2099438907 @default.
- W2157097791 cites W2112241412 @default.
- W2157097791 cites W2113430429 @default.
- W2157097791 cites W2143628457 @default.
- W2157097791 cites W2155744246 @default.
- W2157097791 cites W2191023962 @default.
- W2157097791 doi "https://doi.org/10.1109/ectc.1995.514357" @default.
- W2157097791 hasPublicationYear "2002" @default.
- W2157097791 type Work @default.
- W2157097791 sameAs 2157097791 @default.
- W2157097791 citedByCount "10" @default.
- W2157097791 crossrefType "proceedings-article" @default.
- W2157097791 hasAuthorship W2157097791A5036363549 @default.
- W2157097791 hasAuthorship W2157097791A5060431810 @default.
- W2157097791 hasConcept C111106434 @default.
- W2157097791 hasConcept C119599485 @default.
- W2157097791 hasConcept C121332964 @default.
- W2157097791 hasConcept C126233035 @default.
- W2157097791 hasConcept C127413603 @default.
- W2157097791 hasConcept C137693562 @default.
- W2157097791 hasConcept C151730666 @default.
- W2157097791 hasConcept C159985019 @default.
- W2157097791 hasConcept C165005293 @default.
- W2157097791 hasConcept C167781694 @default.
- W2157097791 hasConcept C186260285 @default.
- W2157097791 hasConcept C192562407 @default.
- W2157097791 hasConcept C204530211 @default.
- W2157097791 hasConcept C24326235 @default.
- W2157097791 hasConcept C2779343474 @default.
- W2157097791 hasConcept C2780395129 @default.
- W2157097791 hasConcept C41008148 @default.
- W2157097791 hasConcept C50296614 @default.
- W2157097791 hasConcept C78519656 @default.
- W2157097791 hasConcept C86803240 @default.
- W2157097791 hasConcept C94709252 @default.
- W2157097791 hasConcept C97346530 @default.
- W2157097791 hasConcept C97355855 @default.
- W2157097791 hasConceptScore W2157097791C111106434 @default.
- W2157097791 hasConceptScore W2157097791C119599485 @default.
- W2157097791 hasConceptScore W2157097791C121332964 @default.
- W2157097791 hasConceptScore W2157097791C126233035 @default.
- W2157097791 hasConceptScore W2157097791C127413603 @default.
- W2157097791 hasConceptScore W2157097791C137693562 @default.
- W2157097791 hasConceptScore W2157097791C151730666 @default.
- W2157097791 hasConceptScore W2157097791C159985019 @default.
- W2157097791 hasConceptScore W2157097791C165005293 @default.
- W2157097791 hasConceptScore W2157097791C167781694 @default.
- W2157097791 hasConceptScore W2157097791C186260285 @default.
- W2157097791 hasConceptScore W2157097791C192562407 @default.
- W2157097791 hasConceptScore W2157097791C204530211 @default.
- W2157097791 hasConceptScore W2157097791C24326235 @default.
- W2157097791 hasConceptScore W2157097791C2779343474 @default.
- W2157097791 hasConceptScore W2157097791C2780395129 @default.
- W2157097791 hasConceptScore W2157097791C41008148 @default.
- W2157097791 hasConceptScore W2157097791C50296614 @default.
- W2157097791 hasConceptScore W2157097791C78519656 @default.
- W2157097791 hasConceptScore W2157097791C86803240 @default.
- W2157097791 hasConceptScore W2157097791C94709252 @default.
- W2157097791 hasConceptScore W2157097791C97346530 @default.
- W2157097791 hasConceptScore W2157097791C97355855 @default.
- W2157097791 hasLocation W21570977911 @default.
- W2157097791 hasOpenAccess W2157097791 @default.
- W2157097791 hasPrimaryLocation W21570977911 @default.
- W2157097791 hasRelatedWork W1773927463 @default.
- W2157097791 hasRelatedWork W1902049426 @default.
- W2157097791 hasRelatedWork W1999256194 @default.
- W2157097791 hasRelatedWork W2065056107 @default.
- W2157097791 hasRelatedWork W2074538695 @default.
- W2157097791 hasRelatedWork W2080090185 @default.
- W2157097791 hasRelatedWork W2080776857 @default.
- W2157097791 hasRelatedWork W2085715146 @default.
- W2157097791 hasRelatedWork W2115890166 @default.
- W2157097791 hasRelatedWork W2117306554 @default.
- W2157097791 hasRelatedWork W2126677790 @default.
- W2157097791 hasRelatedWork W2132401123 @default.
- W2157097791 hasRelatedWork W2221552951 @default.
- W2157097791 hasRelatedWork W2318023343 @default.
- W2157097791 hasRelatedWork W359029216 @default.
- W2157097791 hasRelatedWork W2067850685 @default.
- W2157097791 hasRelatedWork W2397978639 @default.
- W2157097791 hasRelatedWork W2487482518 @default.
- W2157097791 hasRelatedWork W2873685468 @default.
- W2157097791 hasRelatedWork W2978904033 @default.
- W2157097791 isParatext "false" @default.
- W2157097791 isRetracted "false" @default.
- W2157097791 magId "2157097791" @default.
- W2157097791 workType "article" @default.