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- W2157288219 abstract "The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture." @default.
- W2157288219 created "2016-06-24" @default.
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- W2157288219 date "2003-01-22" @default.
- W2157288219 modified "2023-09-27" @default.
- W2157288219 title "Flexible epoxy for low stress electronic component encapsulation" @default.
- W2157288219 doi "https://doi.org/10.1109/eeic.1999.826253" @default.
- W2157288219 hasPublicationYear "2003" @default.
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