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- W2158607321 abstract "Abstract The growth of of metallic copper by atomic layer deposition (ALD) using copper(I) di-sec-butylacetamidinate ([Cu( s Bu-amd)] 2 ) and molecular hydrogen (H 2 ) on SiO 2 /Si surfaces has been studied. The mechanisms for the initial surface reaction and chemical bonding evolutions with each ALD cycle are inferred from in situ Fourier transform infrared spectroscopy (FTIR) data. Spectroscopic evidence for Cu agglomeration on SiO 2 is presented involving the intensity variations of the SiO 2 LO/TO phonon modes after chemical reaction with the Cu precursor and after the H 2 precursor cycle. These intensity variations are observed over the first 20 ALD cycles at 185°C." @default.
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- W2158607321 date "2009-01-01" @default.
- W2158607321 modified "2023-09-27" @default.
- W2158607321 title "FTIR study of copper agglomeration during atomic layer deposition of copper" @default.
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- W2158607321 doi "https://doi.org/10.1557/proc-1155-c11-06" @default.
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