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- W2159646294 abstract "As the demands on high performance and multi-function systems increase, System-in-Package (SIP) provides a method for increasing integration with a reasonable cost and short development time. SIP using vertically stacked (3D) ICs has the advantages of a small form-factor and short communication distance between chips, leading to increased data rate and efficiency. Several wired and wireless approaches for interconnect between 3D ICs have been proposed. Among them, wireless interconnect using inductive-coupling is very promising since it has achieved low power, high performance with small size, and operates across heterogeneous ICs and technologies as illustrated in Fig. 1 [1]." @default.
- W2159646294 created "2016-06-24" @default.
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- W2159646294 date "2010-07-01" @default.
- W2159646294 modified "2023-09-26" @default.
- W2159646294 title "Performance improvement of resonant inductive coupling for wireless 3D IC interconnect" @default.
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- W2159646294 doi "https://doi.org/10.1109/aps.2010.5562078" @default.
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