Matches in SemOpenAlex for { <https://semopenalex.org/work/W2160705519> ?p ?o ?g. }
Showing items 1 to 77 of
77
with 100 items per page.
- W2160705519 abstract "A packaging concept is presented that supports three-dimensional (3-D) interconnect of digital electronics using a stacked multichip module (MCM) approach. The 3-D structure offers an order of magnitude improvement in global communication bandwidth over traditional backplane techniques. This is accomplished by simultaneously reducing interconnect length (propagation delay) and dramatically increasing physical connectivity between layers of electronics. A characterization cube is described that will demonstrate the key technologies behind the 3-D packaging concept. These include synthetic diamond substrates for heat conduction, spray cooling for heat removal, double-sided multi-layer MCM interconnect, and high density connectors that support the required inter-layer signal bandwidth. Size and weight benefits of 3-D packaging are quantified in a specific application comparison. Results suggest that machines normally confined to a computer room environment can be repackaged with this technology for airborne, shipborne, or mobile applications." @default.
- W2160705519 created "2016-06-24" @default.
- W2160705519 creator A5032632279 @default.
- W2160705519 creator A5051263970 @default.
- W2160705519 creator A5069303952 @default.
- W2160705519 date "2002-12-23" @default.
- W2160705519 modified "2023-09-27" @default.
- W2160705519 title "3-D electronic interconnect packaging" @default.
- W2160705519 cites W1970925554 @default.
- W2160705519 doi "https://doi.org/10.1109/aero.1996.495896" @default.
- W2160705519 hasPublicationYear "2002" @default.
- W2160705519 type Work @default.
- W2160705519 sameAs 2160705519 @default.
- W2160705519 citedByCount "15" @default.
- W2160705519 countsByYear W21607055192012 @default.
- W2160705519 countsByYear W21607055192013 @default.
- W2160705519 countsByYear W21607055192019 @default.
- W2160705519 countsByYear W21607055192020 @default.
- W2160705519 crossrefType "proceedings-article" @default.
- W2160705519 hasAuthorship W2160705519A5032632279 @default.
- W2160705519 hasAuthorship W2160705519A5051263970 @default.
- W2160705519 hasAuthorship W2160705519A5069303952 @default.
- W2160705519 hasConcept C119599485 @default.
- W2160705519 hasConcept C123745756 @default.
- W2160705519 hasConcept C127413603 @default.
- W2160705519 hasConcept C134256836 @default.
- W2160705519 hasConcept C138331895 @default.
- W2160705519 hasConcept C186260285 @default.
- W2160705519 hasConcept C186937647 @default.
- W2160705519 hasConcept C192562407 @default.
- W2160705519 hasConcept C24326235 @default.
- W2160705519 hasConcept C2776257435 @default.
- W2160705519 hasConcept C41008148 @default.
- W2160705519 hasConcept C530198007 @default.
- W2160705519 hasConcept C69567186 @default.
- W2160705519 hasConcept C76155785 @default.
- W2160705519 hasConceptScore W2160705519C119599485 @default.
- W2160705519 hasConceptScore W2160705519C123745756 @default.
- W2160705519 hasConceptScore W2160705519C127413603 @default.
- W2160705519 hasConceptScore W2160705519C134256836 @default.
- W2160705519 hasConceptScore W2160705519C138331895 @default.
- W2160705519 hasConceptScore W2160705519C186260285 @default.
- W2160705519 hasConceptScore W2160705519C186937647 @default.
- W2160705519 hasConceptScore W2160705519C192562407 @default.
- W2160705519 hasConceptScore W2160705519C24326235 @default.
- W2160705519 hasConceptScore W2160705519C2776257435 @default.
- W2160705519 hasConceptScore W2160705519C41008148 @default.
- W2160705519 hasConceptScore W2160705519C530198007 @default.
- W2160705519 hasConceptScore W2160705519C69567186 @default.
- W2160705519 hasConceptScore W2160705519C76155785 @default.
- W2160705519 hasLocation W21607055191 @default.
- W2160705519 hasOpenAccess W2160705519 @default.
- W2160705519 hasPrimaryLocation W21607055191 @default.
- W2160705519 hasRelatedWork W1534243973 @default.
- W2160705519 hasRelatedWork W1899170524 @default.
- W2160705519 hasRelatedWork W1917275732 @default.
- W2160705519 hasRelatedWork W1965054448 @default.
- W2160705519 hasRelatedWork W1971007571 @default.
- W2160705519 hasRelatedWork W1973078590 @default.
- W2160705519 hasRelatedWork W1973512043 @default.
- W2160705519 hasRelatedWork W2009220080 @default.
- W2160705519 hasRelatedWork W2020846423 @default.
- W2160705519 hasRelatedWork W2023540721 @default.
- W2160705519 hasRelatedWork W2043171598 @default.
- W2160705519 hasRelatedWork W2043264878 @default.
- W2160705519 hasRelatedWork W2091482314 @default.
- W2160705519 hasRelatedWork W2095210905 @default.
- W2160705519 hasRelatedWork W2107765932 @default.
- W2160705519 hasRelatedWork W2117512401 @default.
- W2160705519 hasRelatedWork W2125948631 @default.
- W2160705519 hasRelatedWork W2154768337 @default.
- W2160705519 hasRelatedWork W2155835798 @default.
- W2160705519 hasRelatedWork W2976911658 @default.
- W2160705519 isParatext "false" @default.
- W2160705519 isRetracted "false" @default.
- W2160705519 magId "2160705519" @default.
- W2160705519 workType "article" @default.