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• W2160926121 abstract "The dielectric properties of thin films deposited on seed layer were investigated. The thin films were deposited by plasma-enhanced atomic layer deposition using and as precursors and plasma as an oxidant. The seed layer was formed through deposition of an SrO layer on a substrate and postannealing in ambient. As a result of introducing seed layers, the dielectric constant of thick thin films increased to 83 compared with that of 16 and 50 for film deposited on Ru directly and seed formed on Ru substrate, respectively." @default.
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• W2160926121 date "2009-01-01" @default.
• W2160926121 modified "2023-10-18" @default.
• W2160926121 title "Enhanced Dielectric Properties of SrTiO[sub 3] Films with a SrRuO[sub 3] Seed by Plasma-Enhanced Atomic Layer Deposition" @default.
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• W2160926121 doi "https://doi.org/10.1149/1.3028218" @default.
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