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• W2162007370 abstract "Although single die eWLB has been around for quite some time, processing of multi-die packages can pose many challenges. In multi-die eWLB package, two or more dies are placed side by side with a small gap, encapsulated by mold compound and interconnected with redistributed layers (RDL) and solder balls. The objective of this paper is to share the challenges in processing multi-die eWLB packages, potential solutions, key processes, results of die position measurements, mold filling, construction analysis, package level and board level reliability tests." @default.
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• W2162007370 date "2010-12-01" @default.
• W2162007370 modified "2023-09-27" @default.
• W2162007370 title "Embedded wafer level BGA (eWLB) - Multi-die" @default.
• W2162007370 cites W1975068766 @default.
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• W2162007370 doi "https://doi.org/10.1109/eptc.2010.5702697" @default.
• W2162007370 hasPublicationYear "2010" @default.
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