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• W2162221256 abstract "Cu pillar bump with eutectic SnPb was annealed and the microstructures were observed by scanning electron microscopy. Both of Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> and Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> Sn grew following parabolic rate law at 120 and 150°C. At 165°C, Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> growth was stagnated while Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> Sn growth rate was increased after 160 hour when all Sn was consumed. Kirkendall void was formed because of different diffusivities of Cu and Sn. The activation energies of Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> , Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</inf> Sn, and Kirkendall void growth were 1.77, 0.72, and 0.36 eV respectively. Intermetallic compound (IMC) growths during 150°C annealing and in current stressing condition were observed to investigate the effect of current stressing. In current stressing condition, the temperature was 150°C and the current density was 5 × 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sup> A/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> . IMC growth in current stressing condition was faster than that during annealing because of electron wind force." @default.
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• W2162221256 date "2008-05-01" @default.
• W2162221256 modified "2023-10-16" @default.
• W2162221256 title "Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing" @default.
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• W2162221256 doi "https://doi.org/10.1109/ectc.2008.4549992" @default.
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