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• W2162221699 abstract "This paper introduces an innovative reconfigurable circuit board for rapid system prototyping. This system supports high pin-count packages and high density system integration requirements, and can be programmed to interconnect integrated circuits and other components at near-intra-chip density. This paper presents the concept and investigates several aspects related to its feasibility. Considered factors include technological and physical constraints; architectural and system aspects; design and technology considerations. Preliminary results are promising, confirming that this smart reconfigurable circuit board can be implemented using a wafer-scale approach in a mature and low-cost 6-metal layer CMOS 0.18 mum technology, with the associated classical design CAD tools and flow. The achieved contact density is sufficient to interconnect components packaged with todaypsilas peripheral I/O and fine-pitched BGA packages." @default.
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• W2162221699 date "2008-06-01" @default.
• W2162221699 modified "2023-10-04" @default.
• W2162221699 title "An active reconfigurable circuit board" @default.
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• W2162221699 doi "https://doi.org/10.1109/newcas.2008.4606393" @default.
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