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- W2162260268 abstract "A novel masterslice MMIC design approach employing a 3-D MMIC structure is described using a highly-integrated 17-24 GHz GaAs single-chip receiver and a 7-10 GHz Si reactive-impedance-matching amplifier, which are the most recent devices fabricated with our process. This approach considerably reduces TAT and manufacturing costs." @default.
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- W2162260268 date "2002-12-24" @default.
- W2162260268 modified "2023-09-27" @default.
- W2162260268 title "Highly integrated 3-D MMIC technology being applied to novel masterslice GaAs- and Si-MMIC's" @default.
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- W2162260268 doi "https://doi.org/10.1109/gaas.1996.567833" @default.
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