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- W2162396905 abstract "This study reports the packaging effects of a small-outline package (SOP) on overall electrical characteristics of RFICs. The parameters of an equivalent coupled-π model circuit are extracted from simulated S-parameters at low frequency. These parameters are then optimized over the desired frequency range for better accuracy. To verify the obtained circuit model, the tuning characteristic of a voltage controlled oscillator (VCO) was tested. The circuit is fabricated using a 0.5 um N-well CMOS process, and packaged in a 28-lead SOP plastic package. Experimental results are shown to closely match the simulation results." @default.
- W2162396905 created "2016-06-24" @default.
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- W2162396905 date "2010-12-01" @default.
- W2162396905 modified "2023-09-27" @default.
- W2162396905 title "Analysis of parasitic effects of small-outline packages for high-frequency integrated circuits" @default.
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- W2162396905 doi "https://doi.org/10.1109/icecs.2010.5724701" @default.
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