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• W2164388738 abstract "A methodology is proposed to characterize the electrical performance of model-based dummy feature insertion in Cu interconnect. Two types of test structures were designed to explore the electrical performance discrepancy between the rule-based and model-based dummy feature insertion. The sheet resistance dependency on design rule is characterized at the various density conditions. 2-D field solver extracts the parasitic capacitance caused by dummy feature insertion. A model-based dummy feature insertion algorithm using randomized shapes is proposed to assist the uniformity control of Cu CMP and MIT/SEMATECH 854 AZ test vehicle is used to demonstrate the feasibility of the proposed algorithm." @default.
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• W2164388738 date "2004-07-20" @default.
• W2164388738 modified "2023-09-23" @default.
• W2164388738 title "Electrical characterization of model-based dummy feature insertion in Cu interconnects" @default.
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• W2164388738 doi "https://doi.org/10.1109/icmts.2004.1309307" @default.
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