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- W2164557385 abstract "Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 nΩ m. An “in situ cleaning” action of PVP is proposed during the bonding process." @default.
- W2164557385 created "2016-06-24" @default.
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- W2164557385 date "2012-01-01" @default.
- W2164557385 modified "2023-10-11" @default.
- W2164557385 title "Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging" @default.
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- W2164557385 doi "https://doi.org/10.1039/c2jm31979a" @default.
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