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- W2164759782 abstract "In this paper, an electrical test method and a power supply circuit are proposed for open defects at interconnects between dies in a 3D IC. The test method is based on volume of charge injected from the power supply circuit. Feasibility of the electrical tests is examined by Spice simulation. The simulation results show that a hard open defect, capacitive ones and resistive ones whose resistance is greater than or equal to 100Ω may be detected at a test speed of 0.9MHz." @default.
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- W2164759782 date "2015-08-01" @default.
- W2164759782 modified "2023-09-25" @default.
- W2164759782 title "Electrical interconnect test method of 3D ICs by injected charge volume" @default.
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- W2164759782 doi "https://doi.org/10.1109/3dic.2015.7334588" @default.
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