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- W2165421393 abstract "The fabrication and characterization of flip-chip assemblies using four polymeric conductive pastes as attachment materials are reported. Three thermoset and one thermoplastic polymeric conductive pastes were investigated. Polymeric conductive pastes having silver particles 2 μm in size made good contact to either smooth or rough metal. Electrical contact with pastes whose particles were 5 μm or larger could only be obtained on rough metal." @default.
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- W2165421393 date "1998-11-01" @default.
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- W2165421393 title "Polymeric conductive pastes as solder replacement for flip-chip attachment" @default.
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- W2165421393 doi "https://doi.org/10.1109/96.730422" @default.
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