Matches in SemOpenAlex for { <https://semopenalex.org/work/W2165896293> ?p ?o ?g. }
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- W2165896293 endingPage "10" @default.
- W2165896293 startingPage "1" @default.
- W2165896293 abstract "There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Cu bonding wires, in general, are severely limited in their use compared to Au wires; such as wire oxidation, lower bondability, forming gas of N 2 +5%H 2 , and lower reliability. It is difficult for conventional bare Cu wires to achieve the target of LSI application. A surface-enhanced Cu wire (EX1) has been developed. It is a Pd-coated Cu wire and has many advantages compared to bare Cu wires. Stitch strength was much better under fresh conditions and maintained without any deterioration after being stored in air for a prolonged period of time. EX1 had a lifetime of over 90 days in air, although it was 7days for the bare Cu wire. Spherical balls were formed with pure N 2 (hydrogen-free), whereas the bare Cu produced offcenter balls. Cost-effective and secure gas, pure N 2 was only available for EX1. The reliability for Cu wire bonding under humid environment was investigated in pressure cooker test (PCT). The lifetime for EX1 and the bare Cu was over 800h and 250h, respectively. Humidity reliability was significantly greater for EX1. Continuous cracking was formed at the bond interface for the bare Cu wire. Corrosion-induced deterioration would be the root cause of failure for bare Cu wires in PCT. EX1 improves the bond reliability by controlling diffusion at the bond interface. The excellent performance of Pd-coated Cu wire, EX1 is comparable with Au wires and suitable for LSI packaging." @default.
- W2165896293 created "2016-06-24" @default.
- W2165896293 creator A5029793661 @default.
- W2165896293 creator A5059704901 @default.
- W2165896293 creator A5085045423 @default.
- W2165896293 date "2009-06-15" @default.
- W2165896293 modified "2023-10-03" @default.
- W2165896293 title "Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment" @default.
- W2165896293 cites W1509441332 @default.
- W2165896293 cites W1546651064 @default.
- W2165896293 cites W1971897257 @default.
- W2165896293 cites W1991700882 @default.
- W2165896293 cites W2086668771 @default.
- W2165896293 cites W2099510585 @default.
- W2165896293 cites W2156483597 @default.
- W2165896293 cites W2171980082 @default.
- W2165896293 cites W2540003770 @default.
- W2165896293 cites W2732717143 @default.
- W2165896293 hasPublicationYear "2009" @default.
- W2165896293 type Work @default.
- W2165896293 sameAs 2165896293 @default.
- W2165896293 citedByCount "0" @default.
- W2165896293 crossrefType "proceedings-article" @default.
- W2165896293 hasAuthorship W2165896293A5029793661 @default.
- W2165896293 hasAuthorship W2165896293A5059704901 @default.
- W2165896293 hasAuthorship W2165896293A5085045423 @default.
- W2165896293 hasConcept C119599485 @default.
- W2165896293 hasConcept C121332964 @default.
- W2165896293 hasConcept C123745756 @default.
- W2165896293 hasConcept C127413603 @default.
- W2165896293 hasConcept C140269135 @default.
- W2165896293 hasConcept C151420433 @default.
- W2165896293 hasConcept C159985019 @default.
- W2165896293 hasConcept C163258240 @default.
- W2165896293 hasConcept C165005293 @default.
- W2165896293 hasConcept C191897082 @default.
- W2165896293 hasConcept C192562407 @default.
- W2165896293 hasConcept C31258907 @default.
- W2165896293 hasConcept C41008148 @default.
- W2165896293 hasConcept C43214815 @default.
- W2165896293 hasConcept C544778455 @default.
- W2165896293 hasConcept C97355855 @default.
- W2165896293 hasConceptScore W2165896293C119599485 @default.
- W2165896293 hasConceptScore W2165896293C121332964 @default.
- W2165896293 hasConceptScore W2165896293C123745756 @default.
- W2165896293 hasConceptScore W2165896293C127413603 @default.
- W2165896293 hasConceptScore W2165896293C140269135 @default.
- W2165896293 hasConceptScore W2165896293C151420433 @default.
- W2165896293 hasConceptScore W2165896293C159985019 @default.
- W2165896293 hasConceptScore W2165896293C163258240 @default.
- W2165896293 hasConceptScore W2165896293C165005293 @default.
- W2165896293 hasConceptScore W2165896293C191897082 @default.
- W2165896293 hasConceptScore W2165896293C192562407 @default.
- W2165896293 hasConceptScore W2165896293C31258907 @default.
- W2165896293 hasConceptScore W2165896293C41008148 @default.
- W2165896293 hasConceptScore W2165896293C43214815 @default.
- W2165896293 hasConceptScore W2165896293C544778455 @default.
- W2165896293 hasConceptScore W2165896293C97355855 @default.
- W2165896293 hasLocation W21658962931 @default.
- W2165896293 hasOpenAccess W2165896293 @default.
- W2165896293 hasPrimaryLocation W21658962931 @default.
- W2165896293 hasRelatedWork W1897774740 @default.
- W2165896293 hasRelatedWork W1988628975 @default.
- W2165896293 hasRelatedWork W2008311313 @default.
- W2165896293 hasRelatedWork W2074703567 @default.
- W2165896293 hasRelatedWork W2082778718 @default.
- W2165896293 hasRelatedWork W2094231427 @default.
- W2165896293 hasRelatedWork W2097553638 @default.
- W2165896293 hasRelatedWork W2100292623 @default.
- W2165896293 hasRelatedWork W2117629792 @default.
- W2165896293 hasRelatedWork W2128086392 @default.
- W2165896293 hasRelatedWork W2131535666 @default.
- W2165896293 hasRelatedWork W2142635684 @default.
- W2165896293 hasRelatedWork W2143829956 @default.
- W2165896293 hasRelatedWork W2146956031 @default.
- W2165896293 hasRelatedWork W2161959486 @default.
- W2165896293 hasRelatedWork W2163030515 @default.
- W2165896293 hasRelatedWork W2167095845 @default.
- W2165896293 hasRelatedWork W2252666707 @default.
- W2165896293 hasRelatedWork W2289685480 @default.
- W2165896293 hasRelatedWork W2106277189 @default.
- W2165896293 isParatext "false" @default.
- W2165896293 isRetracted "false" @default.
- W2165896293 magId "2165896293" @default.
- W2165896293 workType "article" @default.