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• W2166636706 abstract "A BEM formulation is applied to the extraction of series parameters of interconnects on lossy silicon substrate. The numerical formulation can take into account both a semi-infinite homogeneous conductive substrate and a homogeneous conductive substrate of finite thickness with backside metallization." @default.
• W2166636706 created "2016-06-24" @default.
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• W2166636706 date "2011-01-01" @default.
• W2166636706 modified "2023-09-26" @default.
• W2166636706 title "Boundary element computation of line parameters of on-chip interconnects on lossy silicon substrate" @default.
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• W2166636706 doi "https://doi.org/10.1049/cp.2011.0019" @default.
• W2166636706 hasPublicationYear "2011" @default.
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