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• W2166720704 abstract "A new multi-user hybrid surface and bulk micromachining process on silicon-on-insulator (SOI) wafers is discussed. This 13-mask process consists of a doped polysilicon layer for electrical connection and non-critical structures and a single crystal silicon (SCS) layer for excellent optical and mechanical properties in the critical MEMS design. There are 7 masks for doping and etching of the SCS layer. The flexibility and versatility of this process allows for microsystems designs such as actuators, optical gratings, and dimples/anchors on the SCS layer. The MEMS devices fabricated and tested in this paper include thermal actuators, hinges, latches, optical switches, mirrors, and waveguides." @default.
• W2166720704 created "2016-06-24" @default.
• W2166720704 creator A5002095209 @default.
• W2166720704 creator A5002209540 @default.
• W2166720704 creator A5003715261 @default.
• W2166720704 creator A5024059847 @default.
• W2166720704 creator A5033413829 @default.
• W2166720704 creator A5045171950 @default.
• W2166720704 creator A5046626113 @default.
• W2166720704 creator A5047545151 @default.
• W2166720704 creator A5057592391 @default.
• W2166720704 creator A5070440835 @default.
• W2166720704 creator A5072797263 @default.
• W2166720704 creator A5074785806 @default.
• W2166720704 creator A5085499218 @default.
• W2166720704 creator A5088687603 @default.
• W2166720704 creator A5089599226 @default.
• W2166720704 creator A5091295550 @default.
• W2166720704 date "2005-07-06" @default.
• W2166720704 modified "2023-09-24" @default.
• W2166720704 title "Multi-user hybrid process platform for mems devices using silicon-on insulator wafers" @default.
• W2166720704 cites W1489731227 @default.
• W2166720704 cites W2035330026 @default.
• W2166720704 cites W2113389518 @default.
• W2166720704 cites W2119801705 @default.
• W2166720704 cites W2136305965 @default.
• W2166720704 doi "https://doi.org/10.1109/memsys.2005.1453980" @default.
• W2166720704 hasPublicationYear "2005" @default.
• W2166720704 type Work @default.
• W2166720704 sameAs 2166720704 @default.
• W2166720704 citedByCount "1" @default.
• W2166720704 countsByYear W21667207042018 @default.
• W2166720704 crossrefType "proceedings-article" @default.
• W2166720704 hasAuthorship W2166720704A5002095209 @default.
• W2166720704 hasAuthorship W2166720704A5002209540 @default.
• W2166720704 hasAuthorship W2166720704A5003715261 @default.
• W2166720704 hasAuthorship W2166720704A5024059847 @default.
• W2166720704 hasAuthorship W2166720704A5033413829 @default.
• W2166720704 hasAuthorship W2166720704A5045171950 @default.
• W2166720704 hasAuthorship W2166720704A5046626113 @default.
• W2166720704 hasAuthorship W2166720704A5047545151 @default.
• W2166720704 hasAuthorship W2166720704A5057592391 @default.
• W2166720704 hasAuthorship W2166720704A5070440835 @default.
• W2166720704 hasAuthorship W2166720704A5072797263 @default.
• W2166720704 hasAuthorship W2166720704A5074785806 @default.
• W2166720704 hasAuthorship W2166720704A5085499218 @default.
• W2166720704 hasAuthorship W2166720704A5088687603 @default.
• W2166720704 hasAuthorship W2166720704A5089599226 @default.
• W2166720704 hasAuthorship W2166720704A5091295550 @default.
• W2166720704 hasConcept C100460472 @default.
• W2166720704 hasConcept C119599485 @default.
• W2166720704 hasConcept C127413603 @default.
• W2166720704 hasConcept C136525101 @default.
• W2166720704 hasConcept C139159486 @default.
• W2166720704 hasConcept C142724271 @default.
• W2166720704 hasConcept C145667562 @default.
• W2166720704 hasConcept C151054161 @default.
• W2166720704 hasConcept C160671074 @default.
• W2166720704 hasConcept C171250308 @default.
• W2166720704 hasConcept C172707124 @default.
• W2166720704 hasConcept C192562407 @default.
• W2166720704 hasConcept C204787440 @default.
• W2166720704 hasConcept C24326235 @default.
• W2166720704 hasConcept C2779227376 @default.
• W2166720704 hasConcept C37977207 @default.
• W2166720704 hasConcept C41075158 @default.
• W2166720704 hasConcept C49040817 @default.
• W2166720704 hasConcept C53143962 @default.
• W2166720704 hasConcept C544956773 @default.
• W2166720704 hasConcept C71924100 @default.
• W2166720704 hasConceptScore W2166720704C100460472 @default.
• W2166720704 hasConceptScore W2166720704C119599485 @default.
• W2166720704 hasConceptScore W2166720704C127413603 @default.
• W2166720704 hasConceptScore W2166720704C136525101 @default.
• W2166720704 hasConceptScore W2166720704C139159486 @default.
• W2166720704 hasConceptScore W2166720704C142724271 @default.
• W2166720704 hasConceptScore W2166720704C145667562 @default.
• W2166720704 hasConceptScore W2166720704C151054161 @default.
• W2166720704 hasConceptScore W2166720704C160671074 @default.
• W2166720704 hasConceptScore W2166720704C171250308 @default.
• W2166720704 hasConceptScore W2166720704C172707124 @default.
• W2166720704 hasConceptScore W2166720704C192562407 @default.
• W2166720704 hasConceptScore W2166720704C204787440 @default.
• W2166720704 hasConceptScore W2166720704C24326235 @default.
• W2166720704 hasConceptScore W2166720704C2779227376 @default.
• W2166720704 hasConceptScore W2166720704C37977207 @default.
• W2166720704 hasConceptScore W2166720704C41075158 @default.
• W2166720704 hasConceptScore W2166720704C49040817 @default.
• W2166720704 hasConceptScore W2166720704C53143962 @default.
• W2166720704 hasConceptScore W2166720704C544956773 @default.
• W2166720704 hasConceptScore W2166720704C71924100 @default.
• W2166720704 hasLocation W21667207041 @default.
• W2166720704 hasOpenAccess W2166720704 @default.
• W2166720704 hasPrimaryLocation W21667207041 @default.
• W2166720704 hasRelatedWork W1483817182 @default.
• W2166720704 hasRelatedWork W1497861788 @default.
• W2166720704 hasRelatedWork W1549622921 @default.
• W2166720704 hasRelatedWork W1990086435 @default.
• W2166720704 hasRelatedWork W2009389210 @default.
• W2166720704 hasRelatedWork W2026299996 @default.

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