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• W2167155331 abstract "The more advanced microprocessor and ASIC semiconductor packaging currently require several thousand I/O contacts and they are expected to expand contact I/O by 30% in the very near future. Consistent die-to-substrate interface, however, remains the most critical barrier in achieving optimum assembly process yield. Semiconductor suppliers have abandoned the traditional wirebond package assembly for many of these higher I/O products, opting for the more compact die face-down flip-chip attachment methodology. This face-down, direct attachment method significantly reduces the semiconductors package size as well as enhancing product performance. While wire-bond interface may remain the preference for many applications, face-down direct chip attachment has gained popularity for the higher-speed processor and ASIC products. There are a number of factors to consider when selecting an optimal semiconductor package configuration for the newer generations of high density controllers and processors; I/O requirement, package footprint, form factor, thermal dissipation, electrical performance, and cost. This paper will describe a new interconnect solution developed to provide a very uniform array of raised solid copper contact features integrated onto the substrate interposer for mounting very fine pitch bumped flip-chip semiconductor die. This unique raised contact substrate enables semiconductor developers to significantly reduce contact pitch on the die without reducing pad size. Solder bumped die are placed directly onto the raised contact features eliminating the need for solder printing on the package substrate. Mounting the bumped die element on this planer topography solves fundamental issues associated with electro-migration and avoids many of the current assembly process related defects. This is because the raised contact features provide a uniform package interconnect that furnishes a consistent standoff height for improving underfill flow control even with low melt solders." @default.
• W2167155331 created "2016-06-24" @default.
• W2167155331 creator A5043015678 @default.
• W2167155331 creator A5082822326 @default.
• W2167155331 date "2009-12-01" @default.
• W2167155331 modified "2023-09-27" @default.
• W2167155331 title "Improving package assembly process yield for complex high density flip chip applications" @default.
• W2167155331 cites W2054021075 @default.
• W2167155331 cites W2126035799 @default.
• W2167155331 cites W2136486959 @default.
• W2167155331 cites W2141355301 @default.
• W2167155331 cites W2153884005 @default.
• W2167155331 cites W2139599917 @default.
• W2167155331 doi "https://doi.org/10.1109/eptc.2009.5416579" @default.
• W2167155331 hasPublicationYear "2009" @default.
• W2167155331 type Work @default.
• W2167155331 sameAs 2167155331 @default.
• W2167155331 citedByCount "0" @default.
• W2167155331 crossrefType "proceedings-article" @default.
• W2167155331 hasAuthorship W2167155331A5043015678 @default.
• W2167155331 hasAuthorship W2167155331A5082822326 @default.
• W2167155331 hasConcept C100460472 @default.
• W2167155331 hasConcept C108225325 @default.
• W2167155331 hasConcept C111106434 @default.
• W2167155331 hasConcept C111368507 @default.
• W2167155331 hasConcept C119599485 @default.
• W2167155331 hasConcept C123745756 @default.
• W2167155331 hasConcept C125619702 @default.
• W2167155331 hasConcept C126233035 @default.
• W2167155331 hasConcept C127313418 @default.
• W2167155331 hasConcept C127413603 @default.
• W2167155331 hasConcept C140269135 @default.
• W2167155331 hasConcept C146667757 @default.
• W2167155331 hasConcept C158802814 @default.
• W2167155331 hasConcept C159985019 @default.
• W2167155331 hasConcept C160671074 @default.
• W2167155331 hasConcept C162877825 @default.
• W2167155331 hasConcept C165005293 @default.
• W2167155331 hasConcept C165013422 @default.
• W2167155331 hasConcept C171250308 @default.
• W2167155331 hasConcept C184788189 @default.
• W2167155331 hasConcept C186260285 @default.
• W2167155331 hasConcept C192562407 @default.
• W2167155331 hasConcept C24326235 @default.
• W2167155331 hasConcept C2776512755 @default.
• W2167155331 hasConcept C2777289219 @default.
• W2167155331 hasConcept C2779227376 @default.
• W2167155331 hasConcept C41008148 @default.
• W2167155331 hasConcept C49040817 @default.
• W2167155331 hasConcept C50296614 @default.
• W2167155331 hasConcept C530198007 @default.
• W2167155331 hasConcept C59014099 @default.
• W2167155331 hasConcept C68928338 @default.
• W2167155331 hasConcept C76155785 @default.
• W2167155331 hasConcept C78519656 @default.
• W2167155331 hasConcept C79072407 @default.
• W2167155331 hasConcept C94709252 @default.
• W2167155331 hasConceptScore W2167155331C100460472 @default.
• W2167155331 hasConceptScore W2167155331C108225325 @default.
• W2167155331 hasConceptScore W2167155331C111106434 @default.
• W2167155331 hasConceptScore W2167155331C111368507 @default.
• W2167155331 hasConceptScore W2167155331C119599485 @default.
• W2167155331 hasConceptScore W2167155331C123745756 @default.
• W2167155331 hasConceptScore W2167155331C125619702 @default.
• W2167155331 hasConceptScore W2167155331C126233035 @default.
• W2167155331 hasConceptScore W2167155331C127313418 @default.
• W2167155331 hasConceptScore W2167155331C127413603 @default.
• W2167155331 hasConceptScore W2167155331C140269135 @default.
• W2167155331 hasConceptScore W2167155331C146667757 @default.
• W2167155331 hasConceptScore W2167155331C158802814 @default.
• W2167155331 hasConceptScore W2167155331C159985019 @default.
• W2167155331 hasConceptScore W2167155331C160671074 @default.
• W2167155331 hasConceptScore W2167155331C162877825 @default.
• W2167155331 hasConceptScore W2167155331C165005293 @default.
• W2167155331 hasConceptScore W2167155331C165013422 @default.
• W2167155331 hasConceptScore W2167155331C171250308 @default.
• W2167155331 hasConceptScore W2167155331C184788189 @default.
• W2167155331 hasConceptScore W2167155331C186260285 @default.
• W2167155331 hasConceptScore W2167155331C192562407 @default.
• W2167155331 hasConceptScore W2167155331C24326235 @default.
• W2167155331 hasConceptScore W2167155331C2776512755 @default.
• W2167155331 hasConceptScore W2167155331C2777289219 @default.
• W2167155331 hasConceptScore W2167155331C2779227376 @default.
• W2167155331 hasConceptScore W2167155331C41008148 @default.
• W2167155331 hasConceptScore W2167155331C49040817 @default.
• W2167155331 hasConceptScore W2167155331C50296614 @default.
• W2167155331 hasConceptScore W2167155331C530198007 @default.
• W2167155331 hasConceptScore W2167155331C59014099 @default.
• W2167155331 hasConceptScore W2167155331C68928338 @default.
• W2167155331 hasConceptScore W2167155331C76155785 @default.
• W2167155331 hasConceptScore W2167155331C78519656 @default.
• W2167155331 hasConceptScore W2167155331C79072407 @default.
• W2167155331 hasConceptScore W2167155331C94709252 @default.
• W2167155331 hasLocation W21671553311 @default.
• W2167155331 hasOpenAccess W2167155331 @default.
• W2167155331 hasPrimaryLocation W21671553311 @default.
• W2167155331 hasRelatedWork W143804280 @default.
• W2167155331 hasRelatedWork W1496992340 @default.
• W2167155331 hasRelatedWork W1511538352 @default.
• W2167155331 hasRelatedWork W1937843163 @default.

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