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- W2167174369 abstract "This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III-V materials and ionic materials have been discussed." @default.
- W2167174369 created "2016-06-24" @default.
- W2167174369 creator A5010183491 @default.
- W2167174369 date "2009-10-01" @default.
- W2167174369 modified "2023-09-25" @default.
- W2167174369 title "Surface activation based nanobonding technologies for optoelectronics packaging" @default.
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- W2167174369 doi "https://doi.org/10.1109/leos.2009.5343473" @default.
- W2167174369 hasPublicationYear "2009" @default.
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