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- W2167297546 abstract "In this study, fingertip-size integrated silicon tactile sensor-membrane for three-dimensional (3D) surface-shape imaging system has been newly developed. The sensing area is 8 mmphi-area and several-mum thickness silicon membrane. It is swollen like a balloon surface and strain sensor pixel is arrayed on it for detection of surface shape. The movable device structure is fabricated by CMOS compatible post micromachining with SOI wafers. Totally integrated device packaging technology was also developed for surface-shape imaging system. Experimental demonstration of real-time imaging/reading of 3D Braille surface' is presented for the first time. In this system, nearly 1 mum depth resolution is realized at 1Hz-bandwidth by highly sensitive silicon sensor structure with enough robustness in use." @default.
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- W2167297546 date "2009-06-01" @default.
- W2167297546 modified "2023-09-27" @default.
- W2167297546 title "Three dimensional surface-shape tactile imager with fingertip-size silicon integrated sensor-membran" @default.
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- W2167297546 doi "https://doi.org/10.1109/sensor.2009.5285610" @default.
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