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• W2167424730 abstract "The ability to repair defective circuit elements on the high end packaging components being built by IBM for the System/390 is important in meeting yield and reliability targets. A number of laser-based technologies have been developed at IBM, establishing the capability to modify fine line circuit patterns on a range of packaging materials. The ability to control the laser/material interaction with the ability to successfully modify the circuit without adversely affecting the integrity of the dielectric is discussed. Removal of unwanted conductors is done with a computer-controlled, excimer-laser micromachining system operating at 308 nm. New conductor segments are created through the laser chemical vapor deposition of gold from the pyrolytic decomposition of dimethyl-Au-trifluoroacetylacetonate. The applications of these techniques to IBM's thin film packaging are described, with specific focus on the two technologies introduced for the manufacture of high end, thin film packaging products. >" @default.
• W2167424730 created "2016-06-24" @default.
• W2167424730 creator A5045242949 @default.
• W2167424730 date "2003-01-02" @default.
• W2167424730 modified "2023-09-26" @default.
• W2167424730 title "Repair of thin film wiring with laser-assisted processes" @default.
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• W2167424730 doi "https://doi.org/10.1109/ectc.1992.204290" @default.
• W2167424730 hasPublicationYear "2003" @default.
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