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• W2167784957 abstract "A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die. Besides, the eutectic solder bumps (Pb63wt% Sn) have realized high reliability of flip-chip interconnections, compared with the high melting point solder bumps (Pb-3wt% Sn connected with Pb-63wt% Sn)." @default.
• W2167784957 created "2016-06-24" @default.
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• W2167784957 date "2002-11-27" @default.
• W2167784957 modified "2023-09-27" @default.
• W2167784957 title "Thermally enhanced flip-chip BGA with organic substrate" @default.
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• W2167784957 doi "https://doi.org/10.1109/ectc.1998.678772" @default.
• W2167784957 hasPublicationYear "2002" @default.
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