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- W2168179048 abstract "Several challenges should be resolved for three-dimensional integration to evolve to a mainstream technology. Among these challenges, the issues of synchronization and power integrity become predominant due to the multiple planes and the heterogeneity of 3-D circuits. The paper offers an overview of the state of the art research related to these global in nature issues. Experimental results, design techniques, and models are discussed highlighting the possible means and requirements for the design of reliable synchronization and power distribution schemes in 3-D circuits." @default.
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- W2168179048 date "2010-12-01" @default.
- W2168179048 modified "2023-09-30" @default.
- W2168179048 title "Synchronization and power integrity issues in 3-D ICs" @default.
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- W2168179048 doi "https://doi.org/10.1109/apccas.2010.5775082" @default.
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