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- W2168261992 abstract "Micro-hot-embossing is an emerging technology with great potential to form micro- and nano-scale patterns into polymers with high throughput and low cost. Despite its rapid progress, there are still challenges when this technology is employed, as demolding stress is usually very high due to large friction and adhesive forces induced during the process. Surface forces are dominating parameters in micro- and nano-fabrication technologies because of a high surface-to-volume ratio of products. This work attempted to improve the surface properties of Si micro-molds by means of silicon- and nitrogen-doped diamond-like carbon (Si-N-DLC) coatings deposited by dc magnetron cosputtering on the molds. The bonding structure, surface roughness, surface energy, adhesive strength and tribological behavior of the coated samples were characterized with micro Raman spectroscopy, atomic force microscopy (AFM), contact angle measurement, microscratch test and ball-on-disk sliding tribological test, respectively. It was observed that the doping condition had a great effect on the performance of the coatings. The Si-N-DLC coating deposited with 5 × 10 −6 m 3 min −1 N2 had lowest surface roughness and energy of about 1.2 nm and 38.2 × 10 −3 Nm −1 , respectively, while the coatings deposited with 20 × 10 −6 and 25 × 10 −6 m 3 min −1 N2 showed lowest friction coefficients. The uncoated and Si-N-DLC-coated Si micro-molds were tested in a micro-hot-embossing process for a comparative study of their replication performance and lifetime. The experimental results showed that the performance of the Si micro-molds was improved by the Si-N-DLC coatings, and well-defined micro-features with a height of about 100 μm were fabricated successfully into cyclic olefin copolymer (COC) sheets using the Si-N-DLC-coated micro-molds." @default.
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- W2168261992 date "2010-03-15" @default.
- W2168261992 modified "2023-10-16" @default.
- W2168261992 title "Replication performance of Si-N-DLC-coated Si micro-molds in micro-hot-embossing" @default.
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- W2168261992 doi "https://doi.org/10.1088/0960-1317/20/4/045007" @default.
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