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- W2168684995 abstract "Isothermal aging of air quenched solid solution of Ag—8 at%Cu has been investigated in the temperature range 473–773 K by electrical resistivity measurements. The behavior of electrical resistivity in this alloy depends on both the aging temperature as well as the aging time. At all aging temperatures the relative resistivity change (Δϱ/ϱ0) was found to increase with increasing aging time until it reached a maximum value, then decreased with further increase of aging time. The values of (Δϱ/ϱ0) was attributed to the formation and growth of small copper-vacancy clusters, whereas its decrease was referred to the decrease of the scattering power of these clusters. At aging temperatures higher than 0.5Tm, a slight decrease of (Δϱ/ϱ0) was first observed before its increase. This slight decrease was attributed to the rearrangement of quenched-in vacancies. Also, at this temperature range the resistivity peaks took place at longer aging times than those at aging temperatures lower than 0.5 Tm." @default.
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- W2168684995 date "1996-11-01" @default.
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- W2168684995 title "Resistometric study of Ag—8 at % Cu alloy aged in the temperature range 0.4–0.65 Tm" @default.
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- W2168684995 doi "https://doi.org/10.1016/s0921-4526(96)00497-8" @default.
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