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• W2168724131 abstract "A significant improvement of electromigration (EM) lifetime is achieved by modification of pre-clean before cap-layer deposition and Cu cap/dielectric materials. A possible mechanism for EM lifetime enhancement was proposed. Cu-silicide formation before cap-layer deposition and adhesion of Cu/cap interface were found to be critical factors in controlling Cu electromigration reliability. Effects of geometrical layout variation and stress current direction were also investigated." @default.
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• W2168724131 date "2004-08-13" @default.
• W2168724131 modified "2023-10-17" @default.
• W2168724131 title "The improvement of copper interconnect electromigration resistance by cap/dielectric interface treatment and geometrical design" @default.
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• W2168724131 doi "https://doi.org/10.1109/relphy.2004.1315328" @default.
• W2168724131 hasPublicationYear "2004" @default.
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