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• W2169386157 abstract "Carbon-based thermal stabilization techniques have been used for improving performance of CMOS periphery devices in memory application. Current drives are shown to improve by 15 and 30% for N & PMOS, respectively, external resistance of P+ improves by 15 X and N+ by 30%, and RO delay reduction of 25% compared to the conventional contact scheme." @default.
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• W2169386157 date "2009-03-01" @default.
• W2169386157 modified "2023-10-03" @default.
• W2169386157 title "Carbon-based thermal stabilization techniques for junction and silicide engineering for high performance CMOS periphery in memory applications" @default.
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• W2169386157 doi "https://doi.org/10.1109/ulis.2009.4897559" @default.
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