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• W2169486152 abstract "This paper presents a reliability-based design optimization methodology for second level electronic package solder joints. The reliability-based design optimization aims to find the most robust as well as effective design in the possible design space. In this paper, the reliability-based design optimization is defined as a multi-objective design optimization problem: one design objective is to maximize the system performance; another is to minimize the performance variance. A differential evolution optimization algorithm has been modified to handle the multi-objective constrained problems. The response surface is generated with finite element simulations to model the output of the system in the given design space. A probability analysis of the system output is performed on the response surface using a quasi-Monte Carlo simulation method. As a test vehicle, a generic land ball array package interconnect reliability design optimization is analyzed.. By applying the reliability-based design optimization procedure the best design for the most effective and robust system performance is obtained." @default.
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• W2169486152 date "2004-06-21" @default.
• W2169486152 modified "2023-09-26" @default.
• W2169486152 title "Reliability-based design optimization for land grid array solder joints under thermo-mechanical load" @default.
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• W2169486152 doi "https://doi.org/10.1109/esime.2004.1304043" @default.
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