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- W2169504114 abstract "A study on isotropically-conductive adhesive flip chip bonding has been performed at VTT Electronics. The work concentrated on a smart card where a memory chip was flip chip bonded onto a polyimide or an alumina substrate. A separate test flip chip was also used — the substrate materials were FR-4 and alumina. Four isotropically-conductive adhesives were used in flip chip bonding. Adhesives A and B were epoxy-based and adhesives C and D had a thermoplastic polymer matrice. An epoxy underfill material was used with all tested structures. The smart card and test modules were subjected to 2000 thermal cycles between -40°C and +125°C. The biggest factor affecting the reliability of these modules was the choice of a substrate material. When memory and test chips were flip chip bonded to an alumina substrate, almost all bonds survived the thermal cycling test. The memory chips on polyimide substrates also passed the thermal cycling in a fair manner. When FR-4 substrate was used, nearly all daisy chains broke on the test chips, regardless of the conductive adhesive material. The effect of damp heat was studied in 85%RH/85°C-aging for 1000 hours. The damp heat steady aging was not very harmful to the modules with memory or test chips. Separate test series with memory and test chips gave the same trend of results. The thermosetting adhesive B seemed to be the best choice of an adhesive. It is a product especially designed for flip chip bonding." @default.
- W2169504114 created "2016-06-24" @default.
- W2169504114 creator A5058953831 @default.
- W2169504114 creator A5059406038 @default.
- W2169504114 date "1997-12-01" @default.
- W2169504114 modified "2023-09-26" @default.
- W2169504114 title "RELIABILITY TESTING ON FLIP CHIP JOINING WITH ISOTROPICALLY-CONDUCTIVE ADHESIVES" @default.
- W2169504114 doi "https://doi.org/10.1142/s0960313197000300" @default.
- W2169504114 hasPublicationYear "1997" @default.
- W2169504114 type Work @default.
- W2169504114 sameAs 2169504114 @default.
- W2169504114 citedByCount "5" @default.
- W2169504114 crossrefType "journal-article" @default.
- W2169504114 hasAuthorship W2169504114A5058953831 @default.
- W2169504114 hasAuthorship W2169504114A5059406038 @default.
- W2169504114 hasConcept C111368507 @default.
- W2169504114 hasConcept C121332964 @default.
- W2169504114 hasConcept C127313418 @default.
- W2169504114 hasConcept C153294291 @default.
- W2169504114 hasConcept C159985019 @default.
- W2169504114 hasConcept C166595027 @default.
- W2169504114 hasConcept C171359207 @default.
- W2169504114 hasConcept C177564732 @default.
- W2169504114 hasConcept C192562407 @default.
- W2169504114 hasConcept C202374169 @default.
- W2169504114 hasConcept C204530211 @default.
- W2169504114 hasConcept C2777289219 @default.
- W2169504114 hasConcept C2779227376 @default.
- W2169504114 hasConcept C2780965675 @default.
- W2169504114 hasConcept C68928338 @default.
- W2169504114 hasConcept C79072407 @default.
- W2169504114 hasConceptScore W2169504114C111368507 @default.
- W2169504114 hasConceptScore W2169504114C121332964 @default.
- W2169504114 hasConceptScore W2169504114C127313418 @default.
- W2169504114 hasConceptScore W2169504114C153294291 @default.
- W2169504114 hasConceptScore W2169504114C159985019 @default.
- W2169504114 hasConceptScore W2169504114C166595027 @default.
- W2169504114 hasConceptScore W2169504114C171359207 @default.
- W2169504114 hasConceptScore W2169504114C177564732 @default.
- W2169504114 hasConceptScore W2169504114C192562407 @default.
- W2169504114 hasConceptScore W2169504114C202374169 @default.
- W2169504114 hasConceptScore W2169504114C204530211 @default.
- W2169504114 hasConceptScore W2169504114C2777289219 @default.
- W2169504114 hasConceptScore W2169504114C2779227376 @default.
- W2169504114 hasConceptScore W2169504114C2780965675 @default.
- W2169504114 hasConceptScore W2169504114C68928338 @default.
- W2169504114 hasConceptScore W2169504114C79072407 @default.
- W2169504114 hasLocation W21695041141 @default.
- W2169504114 hasOpenAccess W2169504114 @default.
- W2169504114 hasPrimaryLocation W21695041141 @default.
- W2169504114 hasRelatedWork W1622204884 @default.
- W2169504114 hasRelatedWork W1958945622 @default.
- W2169504114 hasRelatedWork W1960283283 @default.
- W2169504114 hasRelatedWork W1978223502 @default.
- W2169504114 hasRelatedWork W1987450683 @default.
- W2169504114 hasRelatedWork W2032649474 @default.
- W2169504114 hasRelatedWork W2040357174 @default.
- W2169504114 hasRelatedWork W2044164952 @default.
- W2169504114 hasRelatedWork W2061357829 @default.
- W2169504114 hasRelatedWork W2104414205 @default.
- W2169504114 hasRelatedWork W2119894771 @default.
- W2169504114 hasRelatedWork W2133669659 @default.
- W2169504114 hasRelatedWork W2144390578 @default.
- W2169504114 hasRelatedWork W2170877016 @default.
- W2169504114 hasRelatedWork W2171593699 @default.
- W2169504114 hasRelatedWork W2176596180 @default.
- W2169504114 hasRelatedWork W2534577521 @default.
- W2169504114 hasRelatedWork W2540890054 @default.
- W2169504114 hasRelatedWork W1907088063 @default.
- W2169504114 hasRelatedWork W2852448294 @default.
- W2169504114 isParatext "false" @default.
- W2169504114 isRetracted "false" @default.
- W2169504114 magId "2169504114" @default.
- W2169504114 workType "article" @default.