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• W2170016265 abstract "We show how stretchable Poly(dimethylsiloxane) (PDMS) electrically conductive composites (ECC) can be fabricated to form flexible, stretchable multilayer interconnects. Multilayer integration through via-like structures enables increased component interconnection and reduced form factor. We show a unique process for forming stretchable multilayer interconnects in PDMS via a bench-top layer-by-layer assembly technique. The SCC is reliable under bending, tensile (e=0.3) and compressive strains. Furthermore, we show how the processes and package designs developed can be applied to the fabrication of stretchable devices. The techniques presented to fabricate ultra-low cost, stretchable, 3D packages hold the potential serve as a package for future stretchable electronic and radio frequency devices." @default.
• W2170016265 created "2016-06-24" @default.
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• W2170016265 date "2011-05-01" @default.
• W2170016265 modified "2023-09-28" @default.
• W2170016265 title "Through silicone vias: Multilayer interconnects for stretchable electronics" @default.
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• W2170016265 doi "https://doi.org/10.1109/ectc.2011.5898719" @default.
• W2170016265 hasPublicationYear "2011" @default.
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