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- W2170331526 abstract "An elaborate analysis of the parasitic network of high-speed through-hole packaging (TO)-type laser modules is presented using a small-signal equivalent circuit model. The intrinsic laser diode is obtained using the optical modulation technique, and is embedded into the model as a separate component. Three step-by-step measurements are made for determining the packaging parasitic network, including the test fixture, TO header, submount, bonding wire, and parasitics of the laser chip. A good agreement between simulated and measured results confirms the validation and accuracy of the characterization procedures. Furthermore, several key parasitic elements are found based on the simulation of the high-frequency responses of the packaged devices. It is expected that the 3-dB bandwidth of 12 GHz or more of the low-cost TO packaged laser module may be achieved using the proposed optimization method" @default.
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- W2170331526 date "2007-02-01" @default.
- W2170331526 modified "2023-09-25" @default.
- W2170331526 title "Characterization of Parasitics in TO-Packaged High-Speed Laser Modules" @default.
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- W2170331526 doi "https://doi.org/10.1109/tadvp.2006.884779" @default.
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