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- W2170384150 abstract "For microwave applications employing high temperature superconductor (HTS) technology to be commercially viable, a high performance cryogenic package is essential. Design considerations to minimise the heat leaks from ambient through conduction along the electrical interconnects and through radiation from the package walls, to reduce the size and mass and to reconcile the physical characteristics of the wide range of materials used within the microwave module and cryogenic package are discussed. Fabrication, process and assembly techniques, which play an important role in determining the long-term reliability of any HTS system, are described. Two examples of the design of cryogenic packages, for commercial and military applications, with inherent mechanical and thermal integrity, high reliability and which do not require a regular maintenance regime are presented to illustrate the design techniques being developed." @default.
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- W2170384150 date "2001-03-01" @default.
- W2170384150 modified "2023-09-27" @default.
- W2170384150 title "High performance cryogenic packaging for microwave applications of high temperature superconductors" @default.
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- W2170384150 doi "https://doi.org/10.1109/77.919390" @default.
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