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- W2170756554 abstract "Soldering nanojoints: Nanowires with a diameter range of 30–200 nm were patterned with solder segments, and the reflow of the solder on these wires was investigated (see Figure). Low-resistance ohmic contacts were observed across solder joints after reflow. Corrosion, oxidation, and intermetallic diffusion play a crucial role in solder reflow and joint formation at the nanoscale." @default.
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- W2170756554 date "2006-01-09" @default.
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- W2170756554 title "Reflow and Electrical Characteristics of Nanoscale Solder" @default.
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- W2170756554 doi "https://doi.org/10.1002/smll.200500296" @default.
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