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- W2170798770 abstract "Electroless nickel (Ni)/immersion gold (Au), an alternative metal finish on printed circuit board (PCB), has been used successfully for many electronic products. However, brittle fracture of PBGA packages soldered on this metal finish was reported recently by several companies. This paper describes brittle fracture in mechanical testing of thermal enhanced, cavity-down PBGA packages, in the as-reflowed and the aged conditions. In the as-reflowed condition, the fracture is a cleavage between PBGA solder balls and PCB conducting pads. The fracture loads, determined from four-point bending, were typically half of that for peeling off PCB conducting pads. Failure analysis showed that the fracture occurred at the interface between Ni/sub 3/Sn/sub 4/ and Ni-P. Three possible failure mechanisms were explored: (1) phosphorous segregation at the interface, (2) contamination or oxidation during the Ni-Au plating or after plating via diffusion, and (3) brittle fracture of Ni-P and Ni/sub 3/Sn/sub 4/. After aging at 150/spl deg/C for a few days, the AuSn/sub 4/ particles, once in the interior of solder joint in the as-reflowed condition, migrated onto the interface. The weak adhesion between Ni/sub 3/Sn/sub 4/ and AuSn/sub 4/ resulted in a more brittle fracture than that before the aging. This Au-related brittle fracture occurred although the Au concentration in solder joint was only 0.1 wt%, much less than 3 wt%, the rule of thumb concentration for brittle solder joint. The Au-related interfacial fracture may be eliminated by reflow after the aging which moved the AuSn/sub 4/ back to the solder joint interior." @default.
- W2170798770 created "2016-06-24" @default.
- W2170798770 creator A5025239984 @default.
- W2170798770 creator A5026300483 @default.
- W2170798770 creator A5033271772 @default.
- W2170798770 creator A5040078987 @default.
- W2170798770 date "2002-11-27" @default.
- W2170798770 modified "2023-10-02" @default.
- W2170798770 title "Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold" @default.
- W2170798770 cites W1970039304 @default.
- W2170798770 cites W2015861972 @default.
- W2170798770 cites W2017052401 @default.
- W2170798770 cites W2028369371 @default.
- W2170798770 cites W2055467088 @default.
- W2170798770 cites W2179127860 @default.
- W2170798770 cites W314240134 @default.
- W2170798770 cites W572291616 @default.
- W2170798770 doi "https://doi.org/10.1109/ectc.1998.678824" @default.
- W2170798770 hasPublicationYear "2002" @default.
- W2170798770 type Work @default.
- W2170798770 sameAs 2170798770 @default.
- W2170798770 citedByCount "47" @default.
- W2170798770 countsByYear W21707987702012 @default.
- W2170798770 countsByYear W21707987702014 @default.
- W2170798770 countsByYear W21707987702015 @default.
- W2170798770 countsByYear W21707987702019 @default.
- W2170798770 countsByYear W21707987702020 @default.
- W2170798770 crossrefType "proceedings-article" @default.
- W2170798770 hasAuthorship W2170798770A5025239984 @default.
- W2170798770 hasAuthorship W2170798770A5026300483 @default.
- W2170798770 hasAuthorship W2170798770A5033271772 @default.
- W2170798770 hasAuthorship W2170798770A5040078987 @default.
- W2170798770 hasConcept C127313418 @default.
- W2170798770 hasConcept C127413603 @default.
- W2170798770 hasConcept C136478896 @default.
- W2170798770 hasConcept C159985019 @default.
- W2170798770 hasConcept C170154142 @default.
- W2170798770 hasConcept C18555067 @default.
- W2170798770 hasConcept C191897082 @default.
- W2170798770 hasConcept C192562407 @default.
- W2170798770 hasConcept C2776985018 @default.
- W2170798770 hasConcept C2988439775 @default.
- W2170798770 hasConcept C43369102 @default.
- W2170798770 hasConcept C50296614 @default.
- W2170798770 hasConcept C8058405 @default.
- W2170798770 hasConcept C97549433 @default.
- W2170798770 hasConceptScore W2170798770C127313418 @default.
- W2170798770 hasConceptScore W2170798770C127413603 @default.
- W2170798770 hasConceptScore W2170798770C136478896 @default.
- W2170798770 hasConceptScore W2170798770C159985019 @default.
- W2170798770 hasConceptScore W2170798770C170154142 @default.
- W2170798770 hasConceptScore W2170798770C18555067 @default.
- W2170798770 hasConceptScore W2170798770C191897082 @default.
- W2170798770 hasConceptScore W2170798770C192562407 @default.
- W2170798770 hasConceptScore W2170798770C2776985018 @default.
- W2170798770 hasConceptScore W2170798770C2988439775 @default.
- W2170798770 hasConceptScore W2170798770C43369102 @default.
- W2170798770 hasConceptScore W2170798770C50296614 @default.
- W2170798770 hasConceptScore W2170798770C8058405 @default.
- W2170798770 hasConceptScore W2170798770C97549433 @default.
- W2170798770 hasLocation W21707987701 @default.
- W2170798770 hasOpenAccess W2170798770 @default.
- W2170798770 hasPrimaryLocation W21707987701 @default.
- W2170798770 hasRelatedWork W1482717449 @default.
- W2170798770 hasRelatedWork W1907699145 @default.
- W2170798770 hasRelatedWork W1908614489 @default.
- W2170798770 hasRelatedWork W1914062284 @default.
- W2170798770 hasRelatedWork W1915169340 @default.
- W2170798770 hasRelatedWork W1971028528 @default.
- W2170798770 hasRelatedWork W2000521532 @default.
- W2170798770 hasRelatedWork W2006205303 @default.
- W2170798770 hasRelatedWork W2036960336 @default.
- W2170798770 hasRelatedWork W2059523013 @default.
- W2170798770 hasRelatedWork W2061687441 @default.
- W2170798770 hasRelatedWork W2062169036 @default.
- W2170798770 hasRelatedWork W2078109311 @default.
- W2170798770 hasRelatedWork W2096712184 @default.
- W2170798770 hasRelatedWork W2124368203 @default.
- W2170798770 hasRelatedWork W2124716290 @default.
- W2170798770 hasRelatedWork W2132246550 @default.
- W2170798770 hasRelatedWork W2140971279 @default.
- W2170798770 hasRelatedWork W2148446584 @default.
- W2170798770 hasRelatedWork W3034651830 @default.
- W2170798770 isParatext "false" @default.
- W2170798770 isRetracted "false" @default.
- W2170798770 magId "2170798770" @default.
- W2170798770 workType "article" @default.