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• W2171489260 abstract "Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions." @default.
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• W2171489260 date "2007-09-24" @default.
• W2171489260 modified "2023-10-09" @default.
• W2171489260 title "Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures" @default.
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• W2171489260 doi "https://doi.org/10.1002/smll.200700343" @default.
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