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- W2178770950 abstract "There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage. The solder joints reliability not only depends on the solder joint alloys, but also on the component metallization and PCB metallization. Reflow profile has significant impact on lead-free solder joint performance also because it influences wetting and microstructure of the solder joint. Majority researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture. There are conflicting views of the reliability comparison between lead-free solders and tin-lead solders. This paper first reviews lead-free solder alloys, lead-free component finishes, and lead-free PCB surface finishes. Tin whisker issue is also discussed. Then the lead-free solder joint testing methods are presented; finite element modeling of lead-free solder joint reliability is reviewed; and experimental data comparing lead-free and tin-lead solder joint reliability are summarized. Finally the paper gives perspectives of transitions to a totally leadfree manufacturing." @default.
- W2178770950 created "2016-06-24" @default.
- W2178770950 creator A5039831956 @default.
- W2178770950 creator A5058659954 @default.
- W2178770950 creator A5075509698 @default.
- W2178770950 date "2004-01-01" @default.
- W2178770950 modified "2023-09-27" @default.
- W2178770950 title "Lead-free Solder Joint Reliability – State of the Art and Perspectives" @default.
- W2178770950 hasPublicationYear "2004" @default.
- W2178770950 type Work @default.
- W2178770950 sameAs 2178770950 @default.
- W2178770950 citedByCount "0" @default.
- W2178770950 crossrefType "journal-article" @default.
- W2178770950 hasAuthorship W2178770950A5039831956 @default.
- W2178770950 hasAuthorship W2178770950A5058659954 @default.
- W2178770950 hasAuthorship W2178770950A5075509698 @default.
- W2178770950 hasConcept C114793014 @default.
- W2178770950 hasConcept C119599485 @default.
- W2178770950 hasConcept C121332964 @default.
- W2178770950 hasConcept C127313418 @default.
- W2178770950 hasConcept C127413603 @default.
- W2178770950 hasConcept C138331895 @default.
- W2178770950 hasConcept C163258240 @default.
- W2178770950 hasConcept C179111330 @default.
- W2178770950 hasConcept C18555067 @default.
- W2178770950 hasConcept C191897082 @default.
- W2178770950 hasConcept C192562407 @default.
- W2178770950 hasConcept C2777093003 @default.
- W2178770950 hasConcept C43214815 @default.
- W2178770950 hasConcept C50296614 @default.
- W2178770950 hasConcept C62520636 @default.
- W2178770950 hasConcept C66938386 @default.
- W2178770950 hasConcept C77595967 @default.
- W2178770950 hasConceptScore W2178770950C114793014 @default.
- W2178770950 hasConceptScore W2178770950C119599485 @default.
- W2178770950 hasConceptScore W2178770950C121332964 @default.
- W2178770950 hasConceptScore W2178770950C127313418 @default.
- W2178770950 hasConceptScore W2178770950C127413603 @default.
- W2178770950 hasConceptScore W2178770950C138331895 @default.
- W2178770950 hasConceptScore W2178770950C163258240 @default.
- W2178770950 hasConceptScore W2178770950C179111330 @default.
- W2178770950 hasConceptScore W2178770950C18555067 @default.
- W2178770950 hasConceptScore W2178770950C191897082 @default.
- W2178770950 hasConceptScore W2178770950C192562407 @default.
- W2178770950 hasConceptScore W2178770950C2777093003 @default.
- W2178770950 hasConceptScore W2178770950C43214815 @default.
- W2178770950 hasConceptScore W2178770950C50296614 @default.
- W2178770950 hasConceptScore W2178770950C62520636 @default.
- W2178770950 hasConceptScore W2178770950C66938386 @default.
- W2178770950 hasConceptScore W2178770950C77595967 @default.
- W2178770950 hasLocation W21787709501 @default.
- W2178770950 hasOpenAccess W2178770950 @default.
- W2178770950 hasPrimaryLocation W21787709501 @default.
- W2178770950 hasRelatedWork W1576676215 @default.
- W2178770950 hasRelatedWork W1589611372 @default.
- W2178770950 hasRelatedWork W1992028918 @default.
- W2178770950 hasRelatedWork W2004414910 @default.
- W2178770950 hasRelatedWork W2070513788 @default.
- W2178770950 hasRelatedWork W2349054874 @default.
- W2178770950 hasRelatedWork W2349130477 @default.
- W2178770950 hasRelatedWork W2353116647 @default.
- W2178770950 hasRelatedWork W2354942538 @default.
- W2178770950 hasRelatedWork W2360237003 @default.
- W2178770950 hasRelatedWork W2366404835 @default.
- W2178770950 hasRelatedWork W2367280949 @default.
- W2178770950 hasRelatedWork W2374172268 @default.
- W2178770950 hasRelatedWork W2384658855 @default.
- W2178770950 hasRelatedWork W2384818878 @default.
- W2178770950 hasRelatedWork W2565800996 @default.
- W2178770950 hasRelatedWork W3142677806 @default.
- W2178770950 hasRelatedWork W653791981 @default.
- W2178770950 hasRelatedWork W659504504 @default.
- W2178770950 hasRelatedWork W1643091225 @default.
- W2178770950 isParatext "false" @default.
- W2178770950 isRetracted "false" @default.
- W2178770950 magId "2178770950" @default.
- W2178770950 workType "article" @default.