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- W2180855296 abstract "This report describes research into the role that surface topography plays in influencing themechanical bond strength of the electroless copper plating of novel glass substrates. Thework considers bespoke laser machining of glass substrates, electroless plating chemistry,areal surface topography analysis using non-contact optical techniques, paramaterization ofthe surfaces using areal parameters described in ISO 25178, and scratch testing of platedcopper to measure the adhesive bond strength. By correlating bond strength to appropriateareal parameters, it is anticipated that better mechanical adhesive potential of machinedglass surfaces can be achieved." @default.
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- W2180855296 date "2012-01-01" @default.
- W2180855296 modified "2023-09-27" @default.
- W2180855296 title "The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications" @default.
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