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- W2182567319 abstract "Silicon photonics technology brings the volume CMOS manufacturing to optical communications in order to address clear values as speed, cost, and integration. However, the targeted data-rate levels for Telecom or Datacom applications require also high speed electronics to be closely connected to the photonics into the optical transceivers. This co-integration is key to scaling bandwidths at low costs. We present different co-integration strategies from multi-chip-module to 3D stacking leading to a still thinner frontier between photonics and electronics. Such a co-empowering opens the way to new applications and architectures." @default.
- W2182567319 created "2016-06-24" @default.
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- W2182567319 date "2015-06-01" @default.
- W2182567319 modified "2023-10-17" @default.
- W2182567319 title "Advances in silicon photonics integration with electronics to move more data faster" @default.
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- W2182567319 doi "https://doi.org/10.1109/oecc.2015.7340290" @default.
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