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- W2183083325 abstract "A life prediction approach has been developed for solder joints under thermal fatigue. The approach is based on fracture mechanics and assumes that the thermal fatigue crack propagation in solder joints is primarily controlled by the C* and the J integrals. The approach is applied to model the experiments by Hall and Sherry (15) and Wong and Helling (59) where surface mounted electronic components were mounted on substrates with eutectic Pb/Sn solder joints and subjected to thermal cycling. The constitutive equation employed here for eutectic solder takes into account elasticity, time-independent plasticity, and power law secondary creep. Shear stress, strain components, and crack growth history in the solder joint are solved numerically by the Runge-Kutta method. The results are compared with both experimental data and predictions based on a modified Manson-Coffin equation (SI. Good agreement is found between the present results and the experimental data, while inconsistency exists when comparing the Manson-Coffin predictions with either the present ones or the experimental data. In addition, examples are given to illustrate how to apply the approach to design accelerated thermal cycling tests." @default.
- W2183083325 created "2016-06-24" @default.
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- W2183083325 date "1992-01-01" @default.
- W2183083325 modified "2023-09-27" @default.
- W2183083325 title "A Fracture Mechanics Approach to Fatigue Life Prediction of Solder Thermal" @default.
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