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- W2183655564 abstract "For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good 0 and 1 state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process." @default.
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- W2183655564 date "2011-01-01" @default.
- W2183655564 modified "2023-09-27" @default.
- W2183655564 title "IBM/Macronix PCRAM Joint Project" @default.
- W2183655564 hasPublicationYear "2011" @default.
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