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- W2185834969 abstract "This extended abstract addresses a saw defects, the s evere backside chipping, when cutting GaAs devices. The author reveals the mechanism of saw blade early failure mode and provides a solution: chemical refreshing saw blade instead of mechanical dressing. This solution improves sawing quality, fully automatic saw throughput, and reduces consumable cost of saw blades. In general, this concept is applicable to improving the cutting of other fragile semiconductor materials as well. THE PURPOSE OF THE WORK Backside chipping is one of major technical challenge when cutting GaAs devices [1] . The project was designed to address the constraints (severe backside chipping) still commonly experienced even in latest improvements. When a new blade is installed and dressed, the sawing device experiences an acceptable minimum of backside chipping. After a short period of cutting, the backside chipping becomes increasingly worse. Finally, blade maintenance, either dressing the blade or replacing it with a new one, needs to be done, otherwise, excessive backside chipping will scrap the entire wafer. As a result of this issue, the saw blade has to be dressed in few thousand cuts, and usually blade has to be replaced before its exposure reaches limits. Therefore, the fully automatic equipment cannot run in fully automatic mode at all times. It undermines the efficiency of fully automatic equipment and not to mention of blade cost. This project focused on discovering the early failure mechanism of the sawing blade and came up with a practical solution. Therefore, This paper addresses the dicing quality issue (backside chipping), as well as improving equipment (saw) throughput and reducing blade cost. THE BLADE EARLY FAILURE MECHANISM" @default.
- W2185834969 created "2016-06-24" @default.
- W2185834969 creator A5063407135 @default.
- W2185834969 date "2002-01-01" @default.
- W2185834969 modified "2023-09-26" @default.
- W2185834969 title "Cutting GaAs Devices Without Blade Dressing" @default.
- W2185834969 cites W2024258154 @default.
- W2185834969 hasPublicationYear "2002" @default.
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