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- W2186476616 abstract "distributed wiring. Foreasytomakethestructure, Itisresearch ofa partofNEDO project Highdifferential signal system was adopted withpaired wiring including conductive adhesive connections. Multiple daisy tdhempverat solderelopm ssun et c ci chainedinterconnection was providedfor fine adhesives development. ~~~measurement asshowninFigure 1.Thepaddimension for BGA byFR-4andprinted wired board byFR-4were th ent asshowninFigure 2. connected usingfirst development article XA-5554of silver andepoxyelectric conduction adhesives, the5GHz _ _ (1OGbps) input signal inBGAwasexamined. Andthehigh frequency signal andpowersupply characteristics ofthe Eutectic sol conductive adhesives weremeasured. Etcia Conductive. Differential signal of1OGbps intotheconnectionS adhesive whichitpassed through eight daisy chains, powercarried outperfectly for1OGbpsoperation. Alsotheactual driver0.6mm diameter for both BGAand substrate lands system which powerconnection passed through eight daisy" @default.
- W2186476616 created "2016-06-24" @default.
- W2186476616 creator A5000457789 @default.
- W2186476616 creator A5067025136 @default.
- W2186476616 date "2007-01-01" @default.
- W2186476616 modified "2023-09-27" @default.
- W2186476616 title "TheGHzregion characteristic oftheBGA-printed wiredboardinterconnection by conductive adhesives" @default.
- W2186476616 hasPublicationYear "2007" @default.
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