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- W2187671330 abstract "The reduction of seiniconcluctor device size to submicroineter range leads to unique electrical and thermal phenomena. Fourier conduction effect was not enough to explain the phenomena and we need to bring in non-Fourier conduction effects to analyse micro-electronic devices. A two-phase lag inodel is used here to bring in the nonFourier effects. A numerical solution procedure based on the tiriite element method and fourth orclcr Rungc-Kutta time marching procedure has been ernploycd for the spatial and temporal discretisations respectively. The predicted results for different boundary con cl it ions, cl early capture thermal wave-like and pure diffusion type phenanena in the appropriate range of time lag values. In electronic packaging, the heat conduction in rnicroccale have to be coiisidcrcd in view of higher Iiciit lluxc~ encounlcrcd in recent time especially when we dent with transicnt heat transfer. A two tliincnsional case is consiilcretl as ii lirst step. The results are encouraging." @default.
- W2187671330 created "2016-06-24" @default.
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- W2187671330 date "2000-01-01" @default.
- W2187671330 modified "2023-09-26" @default.
- W2187671330 title "Numerical modeling of microscale heat conduction effects in electronic package for different thermal boundary conditions" @default.
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