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- W2187788920 abstract "In this chapter, ESD failure analysis techniques are discussed. FA analysis is important in the sense that FA results help circuit designers to better understand ESD protection failure mechanisms and to avoid making similar design mistakes repeatedly. Typical ESD failure signatures, such as, silicon filament, metal interconnect burnout, contact spiking, gate oxide rupture, etc, are discussed. Case examples are given to show how FA analysis techniques can be used in practical design debugging. Latent ESD failure phenomena are described using real examples. Analytical ESD device failure modelling is presented as well. While FA analysis is basically a statistic technique, understanding typical ESD failure mechanisms would certainly increase the success rate of practical ESD protection circuit design." @default.
- W2187788920 created "2016-06-24" @default.
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- W2187788920 date "2006-01-03" @default.
- W2187788920 modified "2023-10-18" @default.
- W2187788920 title "ESD Failure Analysis and Modeling" @default.
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- W2187788920 doi "https://doi.org/10.1007/0-306-47618-5_6" @default.
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