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- W2188283630 abstract "Thispaperannounced a newtypeofbonding interconnect---vertical bonding interconnect. Bonding interconnect isthecritical technique forrealizing the interconnection ofmicrowave chip. Theheight, distance, number ofwires andjoint spaceofbonding interconnect haveimportant effects on itsmicrowavecharacteristics. In thispaper, commercial 3D electromagnetic analysis software HFSS, microwave circuit design software ADS andAgilent vector network analyzer wereusedtomodel, simulate andoptimize for themicrowave characteristics ofbonding interconnect, and produce themodel, experimental results showninthis paper. Keyword: Vertical bonding wireinterconnection, Microwave chip, stacked diepackage" @default.
- W2188283630 created "2016-06-24" @default.
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- W2188283630 date "2008-01-01" @default.
- W2188283630 modified "2023-09-24" @default.
- W2188283630 title "Modeling and Characteristic oftheVertical Bonding" @default.
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- W2188283630 hasPublicationYear "2008" @default.
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