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- W2188332440 abstract "The increasing component packing density and consequent reduction in feature size in printed circuit assemblies (PCA's) continues to place manufacturers under extreme pressures. The most significant demand is for improved first-off process yields because of the high cost and technical difficulty of rework processes and concerns over the reliability of reworked products. The dominant process for the production of PCA's is reflow soldering of a stencil/screen printed solder paste to form the interconnection between the component termination and the substrate. It is crucial for the manufacturer to ensure that each termination experiences a suitable thermal history throughout the reflow cycle. Despite the advances in processes to cope with complex product features, such as increasing the uniformity and amount of heat transfer in the process, ensuring right-the-first-time is still a problem leading to increased lead-times, reduced yields and the scrapping of assemblies used to establish the ideal process parameters for each particular product. This paper describes the utilization of a predictive model as a tool for the off- line determination of the most appropriate process and its specific set-up for a PCA. Results are also presented where PCA design is altered to improve thermal mass distribution. Abstract— A robotic remanufacturing system at Rensselaer has been developed to replace fine pitch surface mounted components on a popu- lated printed circuit board (PCB). The performance goal is to maximize the quality of the solder joint output to optimize the system's throughput. The purpose of this paper is to present the process parameters determined for obtaining a good solder joint with the rework cell developed here and to show an analysis of the solder joint quality obtained from the developed system. Maximizing the rate of correctly reworking components by the system is not chosen as a goal for measuring the system's performance. Abstract— There are numerous applications that could benefit from a capability of providing solder at a stage when it is inconvenient or not possible to be deposited by conventional flip chip or packaging technology methods. For example, flip chip solder bumps are usually fabricated as wafers by evaporation or plating, whereas the solder necessary for component attachment is achieved by extruding or stenciling solder paste onto a card. These methods, although well suited for initial fabrication, are not practical at subsequent stages of assembly. However, decals, which consist of solder bumps of any desired configuration and volume deposited onto a nonwettable carrier (e.g., glass, scrap silicon wafers, etc.), can often be utilized as a solder source in these situations. The paper focuses on decal fabrication, solder transfer, potential problem areas, and solutions. Applications of the technology are discussed as well. Among these are restoration and altering composition of flip chip solder bumps, chip carrier pretinning, wettability testing, and deposition to enable direct chip attach (DCA). Abstract— This paper will discuss the nonproprietary aspects of the work-in-progress regarding developments in flux materials to improve the moisture-induced stress sensitivity of flip chip plastic ball grid ar- ray devices. Studies addressing the moisture characterization and pre- conditioning, using JEDEC Level 3, of assemblies built with four propri- etary fluxes and two alternative underfill materials will be presented. This report includes the evaluation of the weight loss during a simulated die attach reflow profile for each flux type using thermogravimetric analysis. Also, the underfill adhesion strength to the die surface after assembly, after moisture preconditioning and after 48 h of autoclave stressing will be discussed. The integrity of the solder joint corresponding to each flux" @default.
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- W2188332440 date "1998-01-01" @default.
- W2188332440 modified "2023-09-27" @default.
- W2188332440 title "The Effects of Flux Materials on the Moisture Sensitivity and Reliability of Flip Chip on Board Assemblies" @default.
- W2188332440 hasPublicationYear "1998" @default.
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